NOVANOVA NEW ENERGYTECHNOLOGY CO., LTD.

02 / OUR CAPABILITIES

One connected
production journey.

Explore silicon cleaning, crystal growth, machining and wafer slicing.

02 / OUR CAPABILITIES

From raw silicon
to precision wafers.

NOVA entrance and four circular silicon processing views
Silicon Cleaning process illustration

01 / PROCESS

Silicon Cleaning

Remove surface impurities. Prepare material for the next stage.

Impurity removal

Physical and chemical cleaning addresses metal-ion contamination, dust, organic residues and other surface impurities.

Controlled processing

Temperature, duration and chemical concentration are managed according to incoming material and agreed purity requirements.

Crystal Growth process illustration

02 / PROCESS

Crystal Growth

From selected polysilicon to monocrystalline ingots.

Raw-material control

High-purity feedstock selection and furnace preparation support purity throughout feeding, melting and crystallization.

Growth parameters

Temperature gradients, pulling and rotation speeds, and argon flow are controlled to support the required crystal dimensions and properties.

Precision Machining process illustration

03 / PROCESS

Precision Machining

Shape and prepare ingots for wafer production.

Ingot preparation

Squaring and machining prepare silicon ingots for downstream bonding and slicing.

Connected production records

Every squared ingot remains connected to its upstream material records and subsequent wafer production.

Wafer Slicing process illustration

04 / PROCESS

Wafer Slicing

Precision cutting for consistent wafer geometry.

Diamond-wire technology

Diamond-wire cutting and tension control support thickness consistency, surface quality and efficient use of silicon.

Process and inspection

Wire speed, feed rate and cutting conditions are monitored, with attention to thickness deviation and edge integrity.

TAILORED TO YOUR REQUIREMENTS

Individual stages.
Integrated solutions.

Cleaning plans can be adapted to material type and contamination level. Crystal growth and slicing specifications can be discussed around ingot geometry, wafer size, thickness and downstream needs. Contact our team to agree a suitable processing scope.

Discuss contract processing ↗

INSIDE NOVA

Real production.
Seen up close.

A view inside our production process, from silicon material handling to the slicing workshop. Explore four short films recorded on site.

Select a film, then press play. Videos are presented without sound.

Slicing workshop

Your next step starts with a conversation.

Discuss your requirements ↗